The I/O wiring recommendations provide guidance on what type of wires should be used for the different Central IO modules, AS-B server onboard I/O, and BACnet/IP device onboard I/O, how to perform grounding, and how to connect different external devices to the inputs and outputs. This section also provides information on the external connectors required for the RP controller expansion modules. Always use the recommended cables and wires.
For the Central IO modules, most of the wiring is made to the terminal base, and can be done before the electronics module is installed.
For the AS-B server onboard I/O, MP controller onboard I/O, and IP-IO modules, the wiring is made to the removable terminal blocks, and can be done before the AS-B server, MP controller, and IP-IO module are installed on the DIN rail.
For the RP-C controller onboard I/O, the wiring is made to fixed terminal blocks.
Some relay output terminals, Central IO modules, or terminal bases may carry lethal voltages. Always disconnect the power supply and other high voltage equipment connected to the device before wiring.
HAZARD OF ELECTRIC SHOCK, EXPLOSION, OR ARC FLASH
Disconnect the power supply and other high voltage equipment before wiring.
Failure to follow these instructions will result in death or serious injury.
The RP controller expansion modules have PCB mounted connectors for the power input, outputs and digital inputs. The connectors are mechanically keyed and color-coded, which allows the matching external connectors to be plugged in on site quickly and easily.
For digital inputs and outputs, you can use shielded or unshielded wire. Unshielded wires are usually sufficient.
For analog inputs and outputs, you can use shielded or unshielded wire. Shielded wires are recommended if the wiring is placed in a noisy electrical environment. Connect the shield to ground only at a RET terminal.
If the wiring is placed in a noisy electrical environment, shielded wires are recommended for RTD-DI-16 Central IO modules, AS-B server onboard I/Os, and BACnet/IP device onboard I/Os that have the following external connections:
RTD temperature input
RTD resistive input
It is important to perform the grounding correctly for the following reasons:
To design a system that is not harmed by detected minor connection errors.
To design a system that works well and is resistant to EMI.
To minimize the effects of ground currents that can cause unstable measurements.
For more information, see Grounding and Power .
There are many different kinds of external devices from different vendors that can be connected to an EcoStruxure BMS.
For more information, see External Device Connections .
This section provides recommendations on minimum wire sizes (cross-sectional areas) and maximum wire lengths for the wires connected to the screw terminals of Central IO modules, AS-B servers, and BACnet/IP devices. Recommendations on minimum wire size and maximum cable length for the digital inputs of the RP controller expansion modules, the DALI bus of the DALI light modules, and the Zigbee DALI and 0-10V modules are also provided. The recommendations are for guidance only. Other wire sizes and lengths may be used, depending on wiring rules and when appropriate.
For more information, see Wire Sizes and Lengths .
This section provides information on the external connectors that are required for the power supply input, outputs, and digital inputs of the RP controller expansion modules.
For more information, see Required External Connectors for the RP Controller Expansion Modules .